Advanced Packaging Principle Integration Technologist (Principal Engineer, 10 years+ experience)

與我們攜手施展你的超能力！

準備好接受挑戰，探索更多可能性嗎? 我們跟你一樣希望精益求精，持續突破! 我們全球的夥伴熱衷於科技創新，透過我們醫藥保健、生命科學和電子科技業務的解決方案豐富人們的生活。讓我們一起環抱著熱情和夢想關懷我們的員工、客戶、病患和這個世界。這就是我們不斷尋找具備好奇心的新血加入的原因，與我們一起大膽想像各種可能。

我們在電子科技領域裡所做的一切，都是為了能成為眾多企業身後推動數位化生活的推手。我們致力於成為值得信賴的供應商，為電子、汽車和化妝品行業提供高科技材料、服務和特種化學品。我們培養了一個全球協作的組織，每位員工都擁有取勝的熱情、秉持客戶至上的態度、充滿好奇心且行事果決。我們齊心努力突破科學的極限，為客戶創造更多的可能性。

Internal Job Title:  High Performance Packaging Principle Integration Technologist

Summary:

In this role, you will be instrumental in developing our Advanced Packaging opportunity definition, ecosystem engagement strategy, and program development. By connecting across key business unit partners and leveraging our core competencies, you will drive business and product development from idea to proof of concept for transfer to high-volume manufacturing.

The ideal candidate will combine deep equipment, process, and integration knowledge of Advanced Packaging technologies, including Wafer Level Packaging, Hybrid Bonding, Fusion Bonding, and adjacent technologies, with a vast ecosystem network of equipment suppliers, Integrated Device Manufacturer, Foundry, and Memory customers, as well as consortia partners.

Your Role:

Through technical expertise, identify and stay ahead of key Advanced Packaging technology inflection points and roadmaps

Through industry and ecosystem connections, continuously acquire in-depth strategic knowledge of customer and Original Equipment Manufacturer(OEM) roadmaps

Transfer knowledge and educate peers, both laterally and upward, on Advanced Packaging roadmaps

Leverage industry knowledge to identify process, equipment, and integration challenges

Work across business units and the Chief Technology Office to identify material solutions and developments that address industry challenges

Leverage industry networks and connections to engage the ecosystem on collaborative development opportunities

Apply deep technical knowledge to ensure development programs identify and meet industry-standard datasets

Ensure development programs leverage industry expertise to deliver relevant datasets in the most timely manner

Who You Are:

Minimum Qualifications:

Master of Science degree or higher in Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related engineering field

10 or more years of experience developing integration and process flows

10 or more years of hands-on 300mm process and equipment R&D experience

Experience as an Advanced Packaging 300mm Equipment Tool Owner

Experience in Advanced Packaging Thin Film Deposition, Chemical Mechanical Planarization, Bonding, or Patterning process development

7 or more years of collaborative external business development experience

Experience defining Scope of Work, Proof of Concept, and Design of Experiments for equipment and material definition

Preferred Qualifications:

5 or more years of experience engaging with Advanced Packaging consortia, such as IMEC, ITRI, and A*STAR, including engagement model definition, Scope of Work development, and Proof of Concept execution

Demonstrated ability to work effectively in highly ambiguous environments

Demonstrated ability to work across matrixed organizations and deliver results

Demonstrated ability to influence senior stakeholders in order to secure resources

Entrepreneurial mindset with a drive for innovation

Ability to distill complex material into clear, actionable items

Ability to engage and align resources to deliver successful outcomes

Demonstrated knowledge of customer and supplier interactions, with the ability to extract meaningful insights from those conversations

Self-starter with the ability to operate with minimal direction

Work Location: Based in Taiwan (Open to: Taipei, Hsinchu, Tainan, or Kaohsiung offices)

我們來自不同背景、視角與生活經歷，因對世界的好奇心而聚集在一起。我們深信，多元能夠催生卓越與創新，並持續強化我們在科學與技術領域的領導地位。我們致力於為每一個人創造機會，讓大家能依自己的節奏發展與成長。加入我們，一同打造一個充滿包容與歸屬感的文化，影響數百萬人的生活，攜手推動人類的進步！

立即申請，成為這個致力於激發探索精神、提升人類未來的團隊一員！